What do you get when you package up to 256 Intel® Itanium®2 processors into a single computer node? The answer is the architecture for one of the fastest supercomputers in the world—and one heck of a thermal-management challenge.
That's what engineers at Silicon Graphics (SGI) discovered as they put together the design for the new SGI® Altix®3700 Bx2 supercomputer, released to the market at the end of 2004. Their solutions for beating the heating: planarized design for unobstructed airflow, and new designs in fans and heat sinks. Along the way to finding those solutions, engineers also developed technology for helping customers dissipate heat from their computer rooms.
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This page contains a single entry from the blog posted on February 8, 2005 1:12 AM.
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